SIPLUS ET 200SP IM155-6PN ST based on 6ES7155-6AU01-0BN0 with conformal coating, -40…+70 °C, PROFINET interface module, 1 slot for BusAdapter, max. 32 I/O modules, and 16 ET 200AL modules, single hot swap, including server module (6AG1193-6PA00-7AA0)
SIPLUS ET 200SP IM155-6PN ST based on 6ES7155-6AU01-0BN0 with conformal coating, -40…+70 °C, PROFINET interface module, 1 slot for BusAdapter, max. 32 I/O modules, and 16 ET 200AL modules, single hot swap, including server module (6AG1193-6PA00-7AA0)
SIPLUS ET 200SP IM155-6PN ST based on 6ES7155-6AU02-0BN0 with conformal coating, -40...+70 °C interface module IM 155-6 PN ST, max. 32 I/O modules, and 16 ET 200AL modules, multi hot swap, optional PN strain relief, including server module (6AG1193-6PA00-7AA0)
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Information obligation imposed by Article 33, REACH Regulation: This product includes one or several articles in which the following substance of the candidate list is contained in concentrations higher than 0,1% weight by weight (w/w):
Lead
Based on the information currently available, we assume that these substances do not pose any risk if the articles are used as intended (including disposal). Please also refer to product documentation.
Information obligation imposed by Article 33, REACH Regulation: This product includes one or several articles in which the following substance of the candidate list is contained in concentrations higher than 0,1% weight by weight (w/w):
4,4'-isopropylidenediphenol (Bisphenol A, BPA)
Based on the information currently available, we assume that these substances do not pose any risk if the articles are used as intended (including disposal). Please also refer to product documentation.