SIPLUS ET 200SP IM155-6PN ST BA based on 6ES7155-6AA01-0BN0 with conformal coating, -40…+70 °C, bundle PROFINET IM, 1 slot for BusAdapter, max. 32 I/O modules and 16 ET 200AL modules, single hot swap, bundle consists of: interface module (6AG1155-6AU01-7BN0), server module (6AG1193-6PA00-7AA0), BusAdapter BA 2xRJ45 (6AG1193-6AR00-7AA0)
SIPLUS ET 200SP IM155-6PN ST BA based on 6ES7155-6AA01-0BN0 with conformal coating, -40…+70 °C, bundle PROFINET IM, 1 slot for BusAdapter, max. 32 I/O modules and 16 ET 200AL modules, single hot swap, bundle consists of: interface module (6AG1155-6AU01-7BN0), server module (6AG1193-6PA00-7AA0), BusAdapter BA 2xRJ45 (6AG1193-6AR00-7AA0)
Information obligation imposed by Article 33, REACH Regulation: This product includes one or several articles in which the following substance of the candidate list is contained in concentrations higher than 0,1% weight by weight (w/w):
Lead
Based on the information currently available, we assume that these substances do not pose any risk if the articles are used as intended (including disposal). Please also refer to product documentation.
Information obligation imposed by Article 33, REACH Regulation: This product includes one or several articles in which the following substance of the candidate list is contained in concentrations higher than 0,1% weight by weight (w/w):
4,4'-isopropylidenediphenol (Bisphenol A, BPA)
Based on the information currently available, we assume that these substances do not pose any risk if the articles are used as intended (including disposal). Please also refer to product documentation.