SIMATIC ET 200SP, PROFINET interface module IM 155-6PN Standard, max. 32 I/O modules, and 16 ET 200AL modules, single hot swap, incl. server module (6ES7193-6PA00-0AA0)
SIMATIC ET 200SP, PROFINET interface module IM 155-6PN Standard, max. 32 I/O modules, and 16 ET 200AL modules, single hot swap, incl. server module (6ES7193-6PA00-0AA0)
SIMATIC ET 200SP, PROFINET interface module IM 155-6 PN ST, max. 32 I/O modules, and 16 ET 200AL modules, multi hot swap, optional PN strain relief, PN security class 1 incl. server module (6ES7193-6PA00-0AA0)
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Information obligation imposed by Article 33, REACH Regulation: This product includes one or several articles in which the following substance of the candidate list is contained in concentrations higher than 0,1% weight by weight (w/w):
Lead
Based on the information currently available, we assume that these substances do not pose any risk if the articles are used as intended (including disposal). Please also refer to product documentation.
Information obligation imposed by Article 33, REACH Regulation: This product includes one or several articles in which the following substance of the candidate list is contained in concentrations higher than 0,1% weight by weight (w/w):
Lead monoxide (lead oxide)
Based on the information currently available, we assume that these substances do not pose any risk if the articles are used as intended (including disposal). Please also refer to product documentation.
Information obligation imposed by Article 33, REACH Regulation: This product includes one or several articles in which the following substance of the candidate list is contained in concentrations higher than 0,1% weight by weight (w/w):
Dodecachloropentacyclo[12.2.1.16,9.02,13.05,10]octadeca-7,15-diene (“Dechlorane Plus”™) covering any of its individual anti- and syn-isomers or any combination thereof
Based on the information currently available, we assume that these substances do not pose any risk if the articles are used as intended (including disposal). Please also refer to product documentation.